Connectivity makes mobility safer, more efficient, and more convenient. Car interior surfaces are increasingly trending towards touch interfaces and consoles, incorporating capacitive sensing and switching. Our materials solutions are making it possible to merge capacity sensing with 3D shapes and forms, increasing reliability and decreasing failure modes associated with individual mechanical switches or buttons.
We offer broad-base solder materials for SMT components such as passive and LED components as well as for fine pitch SiP (System-in-Package) applications down to 60µm line space. Our materials help to reduce the form factor and weight of electronic modules.
